全自动晶圆级微球植球机 - 北京迪浩Cadence二次开发 ...

全自动晶圆级微球植球机. 适用于 8/12 寸晶圆，通过高精度丝网印刷和视觉 图像处理技术，微球精准对位搭载，实现 WLCSP 封装工艺。. 替代了传统晶圆电镀凸点制作方法， This paper presents a comprehensive review of microball bearing technology over the past eleven years. The design considerations and performance results of devi Microball Microball bearing technology for MEMS devices and integrated ...Microball. It is able to inspect and remove and repair the microballs from a PCB board. It is also sophisticated enough to alarm users when dust is detected. More information available upon request. Datasheet. Model.Microball - Seiwa America